Technical Document
Specifications
Brand
BournsDirection Type
Uni-Directional
Diode Configuration
Complex Array
Maximum Clamping Voltage
6.5V
Minimum Breakdown Voltage
4.5V
Mounting Type
Surface Mount
Package Type
DFN
Maximum Reverse Stand-off Voltage
5V
Pin Count
10
Maximum Peak Pulse Current
4A
ESD protection
Yes
Number of Elements per Chip
6
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Dimensions
4.17 x 2.07 x 0.5mm
Capacitance
22pF
Length
4.17mm
ESD Voltage
15kV
Test Current
50mA
Maximum Reverse Leakage Current
2.5µA
Height
0.5mm
Width
2.07mm
Product details
CDDFN10-0516P SMT TVS Diode ESD Protection Array
The CDDFN10-0516P device from Bourns Electronics provides ESD protection for high speed data ports. The TVS array meets IEC 61000-4-2 (Level 4) requirements and is compatible with USB 3.1. The small footprint DFN10 package has an ultra-low capacitance between I/O lines (typically only 0.02 pF) making it ideal for use on high-speed interfaces.
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Technical Document
Specifications
Brand
BournsDirection Type
Uni-Directional
Diode Configuration
Complex Array
Maximum Clamping Voltage
6.5V
Minimum Breakdown Voltage
4.5V
Mounting Type
Surface Mount
Package Type
DFN
Maximum Reverse Stand-off Voltage
5V
Pin Count
10
Maximum Peak Pulse Current
4A
ESD protection
Yes
Number of Elements per Chip
6
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Dimensions
4.17 x 2.07 x 0.5mm
Capacitance
22pF
Length
4.17mm
ESD Voltage
15kV
Test Current
50mA
Maximum Reverse Leakage Current
2.5µA
Height
0.5mm
Width
2.07mm
Product details
CDDFN10-0516P SMT TVS Diode ESD Protection Array
The CDDFN10-0516P device from Bourns Electronics provides ESD protection for high speed data ports. The TVS array meets IEC 61000-4-2 (Level 4) requirements and is compatible with USB 3.1. The small footprint DFN10 package has an ultra-low capacitance between I/O lines (typically only 0.02 pF) making it ideal for use on high-speed interfaces.