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MG Chemicals Thermal Grease, 1W/m·K

RS Stock No.: 124-7692Brand: MG ChemicalsManufacturers Part No.: 8617-85ml
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Technical Document

Specifications

Thermal Conductivity

1W/m·K

Maximum Operating Temperature

+165°C

Minimum Operating Temperature

-68°C

Pack Size

85 ml

Operating Temperature Range

-68 → +165 °C

Country of Origin

Canada

Product details

MG Chemicals Super Thermal Grease III Zinc

MG Chemicals 8617 super thermal grease III is a non-silicone, zinc oxide free, non-corrosive grease. The thermal grease is designed to improve the thermal interface between irregular and pitted surfaces.

Features and Benefits

High thermal conductivity
Silicone and Zinc Oxide Free
Lowers the contact resistance between irregular surfaces
Extends the life of electronic components
High dielectric strength
Non-bleeding
Non-corrosive
Safe on plastics

Typical Applications

Use the 8617 grease to improve the thermal interface contact conductivity between your heat sinks and heat-generating electronic components such as CPUs, GPU chipsets or power components.

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P.O.A.

MG Chemicals Thermal Grease, 1W/m·K

P.O.A.

MG Chemicals Thermal Grease, 1W/m·K
Stock information temporarily unavailable.

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quantityUnit price
1 - 5P.O.A.
6 - 14P.O.A.
15+P.O.A.

Technical Document

Specifications

Thermal Conductivity

1W/m·K

Maximum Operating Temperature

+165°C

Minimum Operating Temperature

-68°C

Pack Size

85 ml

Operating Temperature Range

-68 → +165 °C

Country of Origin

Canada

Product details

MG Chemicals Super Thermal Grease III Zinc

MG Chemicals 8617 super thermal grease III is a non-silicone, zinc oxide free, non-corrosive grease. The thermal grease is designed to improve the thermal interface between irregular and pitted surfaces.

Features and Benefits

High thermal conductivity
Silicone and Zinc Oxide Free
Lowers the contact resistance between irregular surfaces
Extends the life of electronic components
High dielectric strength
Non-bleeding
Non-corrosive
Safe on plastics

Typical Applications

Use the 8617 grease to improve the thermal interface contact conductivity between your heat sinks and heat-generating electronic components such as CPUs, GPU chipsets or power components.