Panasonic Hinge Lever Micro Switch, Through Hole Terminal, 2 A @ 30 V dc, SPDT, IP67

RS Stock No.: 699-0050Brand: PanasonicManufacturers Part No.: ABS561240
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Technical Document

Specifications

Actuator Type

Hinge Lever

Terminal Type

Through Hole

Contact Current Rating

2 A @ 30 V dc

Contact Configuration

SPDT

IP Rating

IP67

Operating Force

0.34 N

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Contact Material

Silver Alloy

Mechanical Life

5000000Operations

Release Force

0.029N

Operating Temperature Range

-40 → +85°C

Country of Origin

Japan

Product details

ABS Type Sub-miniature Turquoise Microswitch

These sealed subminiature micro switches are only 19.8 x 11.1 x 6.4 mm in size and have a high environmental resistance. Typical applications include home appliances and automotive electrical systems.

Subminiature size
Sealed construction
Elastomer double moulding technology and ultrasonic swaging technology contribute to uniform sealing
Expansion of low-level circuit type

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AED 20.40

Each (ex VAT)

AED 21.42

Each (inc VAT)

Panasonic Hinge Lever Micro Switch, Through Hole Terminal, 2 A @ 30 V dc, SPDT, IP67

AED 20.40

Each (ex VAT)

AED 21.42

Each (inc VAT)

Panasonic Hinge Lever Micro Switch, Through Hole Terminal, 2 A @ 30 V dc, SPDT, IP67
Stock information temporarily unavailable.

Technical Document

Specifications

Actuator Type

Hinge Lever

Terminal Type

Through Hole

Contact Current Rating

2 A @ 30 V dc

Contact Configuration

SPDT

IP Rating

IP67

Operating Force

0.34 N

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Contact Material

Silver Alloy

Mechanical Life

5000000Operations

Release Force

0.029N

Operating Temperature Range

-40 → +85°C

Country of Origin

Japan

Product details

ABS Type Sub-miniature Turquoise Microswitch

These sealed subminiature micro switches are only 19.8 x 11.1 x 6.4 mm in size and have a high environmental resistance. Typical applications include home appliances and automotive electrical systems.

Subminiature size
Sealed construction
Elastomer double moulding technology and ultrasonic swaging technology contribute to uniform sealing
Expansion of low-level circuit type