DIL Sockets

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Part Details Brand Number Of Contacts Mounting Type Pin Type Pitch Row Width Frame Type Termination Method Contact Plating Current Rating Orientation Length Width Depth Dimensions Contact Material Housing Material Series Voltage Rating Minimum Operating Temperature Maximum Operating Temperature
2.54mm low profile THT DIL socket,14 way TE Connectivity - - - - - - - - - - - - - - - - - - - -
DIP Socket,2.54mm,Thru Hole,32way TE Connectivity - - - - - - - - - - - - - - - - - - - -
HARWIN D0 2.54 mm, 7.62 mm Pitch Vertical 8 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 8 Through Hole Standard 2.54 mm, 7.62 mm 7.62mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 10.1mm 10.02mm 2.8mm 10.1 x 10.02 x 2.8mm Beryllium Copper PCT D0 100 V ac, 150 V dc -55°C +125°C
HARWIN D0 2.54 mm, 7.62 mm Pitch Vertical 8 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 8 Through Hole Standard 2.54 mm, 7.62 mm 7.62mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 10.1mm 10.02mm 2.8mm 10.1 x 10.02 x 2.8mm Beryllium Copper PCT D0 100 V ac, 150 V dc -55°C +125°C
HARWIN D2 2.54 mm, 15.24 mm Pitch Vertical 28 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 28 Through Hole Standard 2.54 mm, 15.24 mm 15.24mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 35.5mm 17.64mm 2.8mm 35.5 x 17.64 x 2.8mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
HARWIN D2 2.54 mm, 15.24 mm Pitch Vertical 28 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 28 Through Hole Standard 2.54 mm, 15.24 mm 15.24mm Open Frame Through Hole Gold, Tin over Nickel 1A Vertical 35.5mm 17.64mm 2.8mm 35.5 x 17.64 x 2.8mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
HARWIN D2 2.54 mm, 7.62 mm Pitch Vertical 14 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 14 Through Hole Standard 2.54 mm, 7.62 mm 7.62mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 17.7mm 10.02mm 2.8mm 17.7 x 10.02 x 2.8mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
HARWIN D2 2.54 mm, 7.62 mm Pitch Vertical 14 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 14 Through Hole Standard 2.54 mm, 7.62 mm 7.62mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 17.7mm 10.02mm 2.8mm 17.7 x 10.02 x 2.8mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
HARWIN D2 2.54 mm, 7.62 mm Pitch Vertical 42 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 42 Through Hole Standard 2.54 mm, 7.62 mm 7.62mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 35.5mm 10.02mm 2.8mm 35.5 x 10.02 x 2.8mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
HARWIN D2 2.54 mm, 7.62 mm Pitch Vertical 42 Way, Through Hole Standard pin Open Frame IC Dip Socket, 1A HARWIN 42 Through Hole Standard 2.54 mm, 7.62 mm 7.62mm Open Frame Solder Gold, Tin over Nickel 1A Vertical 35.5mm 10.02mm 2.8mm 35.5 x 10.02 x 2.8mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
IC Socket DIP28 2.54mm TE Connectivity - - - - - - - - - - - - - - - - - - - -
IC Socket DIP40 2.54mm TE Connectivity - - - - - - - - - - - - - - - - - - - -
TE Connectivity 2.54mm Pitch Vertical 14 Way, Through Hole Turned pin Closed Frame IC Dip Socket, 3A TE Connectivity 14 Through Hole Turned 2.54mm 7.62mm Closed Frame Solder Gold, Tin 3A Vertical 17.78mm 11.43mm 13.2mm 17.78 x 11.43 x 13.2mm Beryllium Copper PET - - -55°C +125°C
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Stamped pin Closed Frame IC Dip Socket, 1A TE Connectivity 16 Through Hole Stamped 2.54mm 7.62mm Closed Frame Solder Tin 1A Vertical 20.32mm 5.1mm 10mm 20.32 x 5.1 x 10mm Phosphor Bronze PBT - 250 V ac -40°C +105°C
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 16 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Tin 3A Vertical 20.32mm 4.57mm 10.16mm 20.32 x 4.57 x 10.16mm Beryllium Copper PCT - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Standard pin Closed Frame IC Dip Socket TE Connectivity 16 Through Hole Standard 2.54mm 2.54mm Closed Frame Solder Gold - Vertical 20.32mm 10.16mm 4.57mm 20.32 x 10.16 x 4.57mm Beryllium Copper Thermoplastic - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 35.56mm 4.57mm 17.78mm 35.56 x 4.57 x 17.78mm Beryllium Copper PET - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Standard pin Closed Frame IC Dip Socket TE Connectivity 32 Through Hole Standard 2.54mm 2.54mm Closed Frame Solder Gold - Vertical 40.64mm 17.78mm 4.57mm 40.64 x 17.78 x 4.57mm Beryllium Copper Thermoplastic - - - +105°C
TE Connectivity 2.54mm Pitch Vertical 6 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 6 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold over Nickel 3A Vertical 50.8mm 4.57mm 17.78mm 50.8 x 4.57 x 17.78mm Beryllium Copper PCT - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Turned pin Open Frame IC Dip Socket, 3A TE Connectivity 8 Through Hole Turned 2.54mm 7.62mm Open Frame Solder Gold 3A Vertical 10.16mm 10.16mm 2.67mm 10.16 x 10.16 x 2.67mm Beryllium Copper PET - - -55°C +105°C
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