Technical Document
Specifications
Brand
TDKInductance
10 μH
Maximum dc Current
800mA
Package/Case
3010
Length
3mm
Depth
3mm
Height
1mm
Dimensions
3 x 3 x 1mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
468mΩ
Series
VLS-E
Core Material
Ferrite
Inductor Construction
Shielded
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules
TDK Non Standard SMT Inductors (Chokes)
Stock information temporarily unavailable.
Please check again later.
AED 1.05
Each (Supplied on a Reel) (ex VAT)
AED 1.102
Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
10
AED 1.05
Each (Supplied on a Reel) (ex VAT)
AED 1.102
Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
10
Technical Document
Specifications
Brand
TDKInductance
10 μH
Maximum dc Current
800mA
Package/Case
3010
Length
3mm
Depth
3mm
Height
1mm
Dimensions
3 x 3 x 1mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
468mΩ
Series
VLS-E
Core Material
Ferrite
Inductor Construction
Shielded
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules