Air coolers | RS UAE

Brand

Schneider Electric (37)

nVent HOFFMAN (15)

Rittal (13)

Pfannenberg (5)

Fischer Elektronik (2)

RS Pro (2)

Phoenix Contact (1)

Category

Cooling Units (56)

Air Coolers (15)

Cabinet Coolers (2)

Heatsinks (2)

Min Temperature Setting

20°C (41)

-10°C (2)

25°C (2)

5°C (1)

Refrigerant Type

R134A (38)

R513a (4)

134A (1.2 Kg) (1)

R134A (0.23 Kg) (1)

R134A (0.46 Kg) (1)

Maximum Temperature Setting

55°C (32)

50°C (8)

45°C (2)

IP Rating

IP55 (11)

IP24, IP55 (9)

IP54 (7)

IP24, IP54 (4)

IP54, IP24 (2)

IP54, IP34 (2)

IP55, IP24 (2)

IP55, IP34 (1)

IP65, IP55 (1)

Type of installation

Indoor (21)

Indoor Roof (10)

Outdoor Side (6)

For Installation In E-Mobility Charging Stations (Evse) (1)

Roof Mount (1)

Certification

UL (25)

UL, IEC (6)

CE (2)

IEC, UL (2)

2014/30/EU, 2006/42/EC (1)

electromagnetic compatibility 2011/65/EU, Directives 2006/42/EC, RoHS, IEC, UL, machinery 2014/30/EU (1)

Product Type

Thermoelectric Cooler (15)

Enclosure Cooling Unit (10)

Enclosure Fan (3)

Heatsink (2)

Pneumatic Cabinet Cooler (2)

Air Conditioning Unit (1)

Manufacturer

nVent Hoffman (15)

Pfannenberg (5)

Rittal (4)

Fischer Elektronik (2)

RS Pro (2)

Phoenix Contact (1)

Maximum Supply Voltage

230V ac (10)

460V ac (5)

240V ac (3)

24V dc (2)

480V ac (2)

115V ac (1)

Connection Type

Screw (10)

Side (6)

Side Connected (4)

Quick Release Coupling, Inflow and Return Flow (1)

Side Installation (1)

Mount Type

Wall (17)

Side (3)

Ceiling (1)

Roof (1)

Series

TE1 (10)

PEF180 (3)

TE0 (3)

TE (2)

Supply Voltage

24 V (9)

48 V (4)

24 V, 48 V (1)

48 V dc, 24 V (1)

Standards/Approvals

No (6)

RoHS (1)

Material

Aluminium (3)

Aluminium, Stainless Steel (1)

Application

Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, Heat Sink For Microprocessor, Heat Sink For Dil and Ic, Hole Pattern, Heat Sink For Pentium III/Xeon, SMD, Heat Sink For Power PC, Heat Sink For PLCC, Heat Sink For IC, Heatsink for PGA, Cooler (1)

Heat Sink For Bga, Heat Sink For Pentium Pro, Heat Sink For Pentium III/Xeon, Ic Processors, PGA, Semiconductor, SMD, Fan, Pin Heat Sinks, Heatsink for PGA, Power PC, Heat Sink For IC, Bga, Microprocessor, Cooler, PLCC, Heat Sink For III Mobile Module (1)

Compatible Package Type

PGA, LED, SMD, DIL, PLCC, BGA (1)

SMD, LED, PGA, PLCC, BGA, DIL/IC (1)

Length

32.7mm (1)

43.6mm (1)

Special Features

Constant Heat Distribution in Base and Pins, Excellent Thermal Conductivity by Alloy Material Al 205 W/mK and Homogeneous Arrangement of Materials, Low Weight by Optimised Geometry, Fan Motors Available With Other Operating Voltages on Request, Excellent Thermal Efficiency by Flow-Favorable Omnidirectional Fin Geometry, Low Current Consumption and Thus Low Self-Heating, Other Pin Lengths and Surfaces on Request, Compact Design With High Mechanical Stability, Can Be Glued Directly on BGA Component, Motor Axle With Double Ball Bearings Ensures High Reliability and Long Product Life, Also Available With Pulse Output and Alarm Device Circuit, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Arrangement and Number of Pins for Optimum Air Flow, Suitable for Forced and Free Convection, Customer-specific Modifications and Special Designs, Particularly Suited for Ball Grid Arrays (1)

Excellent Thermal Conductivity by Alloy Material Al W/mK and Homogeneous Arrangement of Materials, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Suitable for Forced and Free Convection, Customer-specific Modifications and Special Designs, Arrangement and Number of Pins for Optimum Air Flow, Fan Motor Axle With Double Ball Bearings for High Reliability and Long Product Life, Low Weight by Optimised Geometry, Low Current Consumption and Thus Low Self-Heating, Fan Motors With Other Operating Voltages on Request, Compact Design With High Mechanical Stability, Thermally Conductive Adhesive Foil or Glue, Easy Mounting Using Fixing Clamp, Constant Heat Distribution in Base and Pins in Direction of Heat Flow, Surface Black Anodised or Al Natural, Excellent Thermal Efficiency by Flow-Favorable Omnidirectional Fin Geometry, Fan Motors Also Available With Pulse Output and Alarm Device Circuit, Special High-Grade Industrial Type, Other Pin Lengths and Surfaces on Request (1)

"Air coolers"

nVent HOFFMAN TE 567 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE0 178 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE0 178 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE0 178 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 321 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 321 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 166 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE 567 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 321 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 321 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 321 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 567 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 166 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 567 Btu/h Thermoelectric Cooler

nVent HOFFMAN TE1 567 Btu/h Thermoelectric Cooler

RS PRO 35 cfm 1500 Btu/h Pneumatic Cabinet Cooler

RS PRO 35 cfm 1500 Btu/h Pneumatic Cabinet Cooler

Phoenix Contact HPC CCS type Series Air Conditioning Unit, 0.06kW 24 V dc 534 mm 403 mm 198 mm

Rittal SK Series Enclosure Cooling Unit, 100W, 45 m³/h 240 V ac 400 mm 125 mm 155 mm

Rittal TopTherm Series Enclosure Cooling Unit, 360W, 310 m³/h 230 V ac 550 mm 280 mm 140 mm

Rittal TopTherm Series Enclosure Cooling Unit, 550W, 800 m³/h 230 V ac 417 mm 597 mm 380 mm

Rittal TopTherm Series Enclosure Cooling Unit, 1500W, 491 m³/h 230 V ac 417 mm 597 mm 475 mm

Rittal TopTherm Blue e Series Enclosure Cooling Unit, 1100W, 600 m³/h 230 V ac 950 mm 400 mm 260 mm

Pfannenberg Enclosure Cooling Unit, 580W, 280 m³/h 230 V ac 565 mm 212 mm 310 mm