LED Chips | RS UAE

Automotive Standard

No (78)

AEC-Q100 Rev C (2)

AEC-Q101 (2)

Mount Type

Surface Mount (64)

Surface (4)

Through Hole (2)

Panel (1)

Package Type

Chip LED (28)

0603 (12)

0402 (3)

1005 (2)

DO-214AC (SMA) (2)

PLCC (2)

POWERMITE (2)

TSSOP-38 (2)

Chip (1)

Standards/Approvals

RoHS (25)

No (21)

JEDEC (3)

Class 1A ESD sensitive per JESD22-A114C.01 (2)

IEC 60929 IEC 62386 (2)

RoHS, CE (1)

Number of Pins

2 (37)

6 (8)

38 (2)

4 (2)

Packaging

Tape & Reel (36)

8 mm tape on 7 in Dia Reel (4)

Reel (4)

Aluminium bag (2)

One Reel in Aluminium Bag (1)

Tray (1)

Lens Colour

Clear (33)

Diffused (2)

Green (2)

Red (2)

Milky (1)

Milky White (1)

Lens Finish

Clear (24)

Diffused (8)

Milky White Diffused Resin (2)

Non-Diffused (2)

Transparent Colourless (2)

Lens Shape

Rectangular (27)

Square (5)

Dome (4)

Number of LEDs

1 (14)

3 (8)

Maximum Operating Temperature

85°C (8)

150°C (4)

100°C (2)

105°C (2)

70°C (1)

Minimum Operating Temperature

-40°C (14)

-45°C (2)

-20°C (1)

Diameter

21.03 mm (4)

4.8mm (3)

4.9mm (2)

16.27 mm (1)

32.5 mm (1)

5.5mm (1)

50 mm (1)

70mm (1)

Peak Wavelength

950nm (4)

570nm (2)

630nm (2)

525nm (1)

590nm (1)

635nm (1)

660nm (1)

860nm (1)

Current

200mA (4)

12.5mA (3)

20mA (2)

5mA (2)

1.2mA (1)

Maximum Supply Voltage

3.6V (5)

2.4V (2)

2.8V (2)

5.5V (2)

4.8V (1)

Compatible Package Type

BGA (2)

TO-220 (2)

LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot (1)

LED, PGA, Slot, IC, DIL/IC, Chip, BGA, SMD, PLCC (1)

PGA, BGA, DIL/IC, PLCC, Chip, IC, LED, SMD (1)

PGA, PLCC, DIL/IC, SMD, IC, BGA, LED, Chip (1)

PGA, Slot, DIL/IC, PLCC, SMD, BGA, LED, IC, Chip (1)

PLCC, BGA, IC, PGA, Chip, LED, SMD, DIL/IC, Slot (1)

TO-220, TO-218 (1)

LED Luminous Flux

0.15 lm (2)

300 mLm (2)

300 to 760 mlm (2)

520 mLm (2)

595 lm (2)

1450 To 1720 lm (1)

Chip Type

Single Chip (8)

Multichip (1)

Life Hours

100000h (8)

60000h (1)

Light Output Colour

Red (3)

White (3)

Green (2)

Yellow (1)

Radiant Flux

0.45W (4)

35mW (3)

40mW (2)

Minimum Supply Voltage

1.7V (2)

1.8V (2)

2V (2)

2.4V (1)

3.3V (1)

Thermal Resistance

13.5°C/W (1)

14.7°C/W (1)

3.1°C/W (1)

4.2°C/W (1)

5.6°C/W (1)

5°C/W (1)

8.55°C/W (1)

9°C/W (1)

Application

Digital Camera, Webpads, Mobile Phone, PDA, TV (2)

Cooler, Pentium, Heat Sink For IC, PLCC, Ic Processors, PGA, Fan, Power PC, Microprocessor, Bga, SMD (1)

High Power Semiconductor Device, Optoelectronic Device (1)

Microprocessor, Technical Introduction, Fan, Cooler, PLCC, Bga, Power PC, Ic Processors, Processor Overview, PGA, SMD, Heat Sink For IC (1)

Optoelectronic Device, High Power Semiconductor Device (1)

PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD (1)

Voltage

30V (3)

110V ac (2)

110V dc (1)

24V dc (1)

Special Features

Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings (1)

Constant Heat Distribution in the Base and the Pins in the Direction of Heat Flow, Components Fastened Using Glue, Other Pin Lengths and Surfaces on Request, Customer-specific Modifications and Special Designs, Fan Motors With Other Operating Voltages on Request, Excellent Thermal Conductivity by the Alloy Material Al, Particularly Suited for Ball Grid Arrays, Adhesive Foil or Clamps, Fan Motors Also Available With Pulse Output and Alarm Device Circuit, Low Weight Achieved by Optimised Geometry, Compact Design With High Mechanical Stability, Effective Heat Dissipation Achieved by Optimum Design of Fan Motor and Heatsink, Fan Motor Axle With Double Ball Bearings Ensures High Reliability and Long Product Life, Low Current Consumption and Thus Low Self-Heating (1)

Excellent Thermal Efficiency, Particularly Suited for Ball Grid Arrays, Can Be Glued Directly on BGA Component, Customer-specific Modifications and Special Designs, Effective Heat Dissipation, Compact Design, Other Pin Lengths and Surfaces on Request, Pulse Output and Alarm Device Circuit for Fans, Low Weight by Optimised Geometry, Low Current Consumption, Flow-favourable Omnidirectional Fin Geometry, Easy Mounting, High Mechanical Stability (1)

Flow-favourable Omnidirectional Fin Geometry, Compact Design With High Mechanical Stability, Excellent Thermal Efficiency, Double Ball Bearings, Custom Specific Modifications and Special Designs, Effective Heat Dissipation, Pulse Output and Alarm Device Circuit Available, Other Pin Lengths and Surfaces on Request, Low Current Consumption (1)

Other Pin Lengths and Surfaces on Request, Custom Modifications, Low Current Consumption, Double Ball Bearings, High Reliability, Low Weight, Special Designs, Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry and Black Anodised Surface, High Mechanical Stability, Easy Mounting, Effective Heat Dissipation (1)

Other Pin Lengths and Surfaces on Request, Fan Motors Also Available With Pulse Output and Alarm Device Circuit, Suitable for Forced and Free Convection, Components Fastened Using Glue, Fan Motors With Other Operating Voltages on Request, Adhesive Foil or Clamps, High Reliability and Long Product Life, Excellent Thermal Conductivity by the Alloy Material, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Low Weight Achieved by Optimised Geometry, High-grade Industrial Type, Customer-specific Modifications and Special Designs, Low Current Consumption and Thus Low Self-Heating, Fan Motor Axle With Double Ball Bearings, Constant Heat Distribution in the Base and Pins in the Direction of Heat Flow, Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry, Compact Design With High Mechanical Stability (1)

Typical Fall Time

200μs (2)

300ns (2)

5000μs (2)

Typical Rise Time

200μs (2)

300ns (2)

500μs (2)

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