Technical Document
Specifications
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Country of Origin
United States
Product details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
AED 242.44
AED 242.44 Each (ex VAT)
AED 254.56
AED 254.56 Each (inc. VAT)
1
AED 242.44
AED 242.44 Each (ex VAT)
AED 254.56
AED 254.56 Each (inc. VAT)
1
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quantity | Unit price |
---|---|
1 - 49 | AED 242.44 |
50 - 99 | AED 233.94 |
100 - 249 | AED 226.01 |
250 - 499 | AED 218.61 |
500+ | AED 212.20 |
Technical Document
Specifications
Brand
BergquistDimensions
11 x 12in
Thickness
0.102mm
Length
11in
Width
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Maximum Operating Temperature
+120°C
Material Trade Name
Hi-Flow 225F-AC
Operating Temperature Range
Maximum of +120 °C
Country of Origin
United States
Product details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm