Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 181.12
AED 36.225 Each (In a Pack of 5) (ex VAT)
AED 190.18
AED 38.036 Each (In a Pack of 5) (inc. VAT)
5
AED 181.12
AED 36.225 Each (In a Pack of 5) (ex VAT)
AED 190.18
AED 38.036 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | AED 36.225 | AED 181.12 |
125 - 370 | AED 32.602 | AED 163.01 |
375 - 995 | AED 28.928 | AED 144.64 |
1000 - 1995 | AED 25.358 | AED 126.79 |
2000+ | AED 23.572 | AED 117.86 |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.