Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
AED 147.29
AED 14.729 Each (In a Tube of 10) (ex VAT)
AED 154.65
AED 15.465 Each (In a Tube of 10) (inc. VAT)
10
AED 147.29
AED 14.729 Each (In a Tube of 10) (ex VAT)
AED 154.65
AED 15.465 Each (In a Tube of 10) (inc. VAT)
10
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
10 - 240 | AED 14.729 | AED 147.29 |
250 - 740 | AED 13.236 | AED 132.36 |
750 - 1990 | AED 11.794 | AED 117.94 |
2000 - 3990 | AED 10.30 | AED 103.00 |
4000+ | AED 9.682 | AED 96.82 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).