Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil

Name: Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil
Brand: Fischer Elektronik
SKU: 6744765
Availability: LimitedAvailability

RS Stock No.: 674-4765Brand: Fischer ElektronikManufacturers Part No.: ICK BGA 35x35x10

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Technical Document

Specifications

Brand

Fischer Elektronik

For Use With

Universal Square Alu

Length

35mm

Width

35mm

Height

10mm

Dimensions

35 x 35 x 10mm

Thermal Resistance

15.7K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Country of Origin

Germany

Product details

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

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Heatsink, BGA, 4.6K/W, 33 x 33 x 6mm, ClipBrand: Malico

P.O.A.Each (ex VAT)

Stock information temporarily unavailable.

AED 15.22

AED 15.22 Each (ex VAT)

AED 15.98

AED 15.98 Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil

AED 15.22

AED 15.22 Each (ex VAT)

AED 15.98

AED 15.98 Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil

Stock information temporarily unavailable.

Please check again later.

quantity	Unit price
1 - 9	AED 15.22
10 - 24	AED 14.02
25 - 49	AED 13.60
50 - 99	AED 13.34
100+	AED 12.44

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).