Technical Document
Specifications
Brand
BournsInductance
2.2 μH
Maximum dc Current
1.3A
Package/Case
252009
Length
2.5mm
Depth
2mm
Height
0.9mm
Dimensions
2.5 x 2 x 0.9mm
Shielded
Yes
Maximum DC Resistance
80mΩ
Series
CVH252009
Core Material
Ferrite
Maximum Self Resonant Frequency
40MHz
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Country of Origin
Taiwan, Province Of China
Product details
Bourns 1008 CVH252009 Series Multilayer Power Chip Inductors
CVH252009 chip inductors from Bourns are a low profile solution, offered in a 1008 case size. A monolithic construction ensures high reliability. These power inductors feature a magnetically shielded construction which enables low radiation. CVH252009 inductors have low DC resistance.
Product Application Information
These chip power inductors are recommended for DC-DC converter applications. Examples include smartphones, tablets, SSD, HDDS, DVCs and DSCs.
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AED 0.45
Each (In a Pack of 20) (ex VAT)
AED 0.472
Each (In a Pack of 20) (inc VAT)
20
AED 0.45
Each (In a Pack of 20) (ex VAT)
AED 0.472
Each (In a Pack of 20) (inc VAT)
20
Technical Document
Specifications
Brand
BournsInductance
2.2 μH
Maximum dc Current
1.3A
Package/Case
252009
Length
2.5mm
Depth
2mm
Height
0.9mm
Dimensions
2.5 x 2 x 0.9mm
Shielded
Yes
Maximum DC Resistance
80mΩ
Series
CVH252009
Core Material
Ferrite
Maximum Self Resonant Frequency
40MHz
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
Minimum Operating Temperature
-55°C
Country of Origin
Taiwan, Province Of China
Product details
Bourns 1008 CVH252009 Series Multilayer Power Chip Inductors
CVH252009 chip inductors from Bourns are a low profile solution, offered in a 1008 case size. A monolithic construction ensures high reliability. These power inductors feature a magnetically shielded construction which enables low radiation. CVH252009 inductors have low DC resistance.
Product Application Information
These chip power inductors are recommended for DC-DC converter applications. Examples include smartphones, tablets, SSD, HDDS, DVCs and DSCs.