Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
AED 85.94
AED 85.94 Each (ex VAT)
AED 90.24
AED 90.24 Each (inc. VAT)
1
AED 85.94
AED 85.94 Each (ex VAT)
AED 90.24
AED 90.24 Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| Quantity | Unit price |
|---|---|
| 1 - 9 | AED 85.94 |
| 10 - 49 | AED 77.54 |
| 50+ | AED 68.83 |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor