Technical Document
Specifications
Brand
BergquistProduct Type
Thermal Interface Sheet
Thickness
0.08in
Thermal Conductivity
0.9W/mK
Self-Adhesive
Yes
Hardness
Shore OO 40
Conductive Material
Polymer
Width
100 mm
Length
100mm
Standards/Approvals
RoHS
Colour
Green
Maximum Operating Temperature
125°C
Minimum Operating Temperature
-60°C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating
Stock information temporarily unavailable.
AED 137.55
AED 137.55 Each (ex VAT)
AED 144.43
AED 144.43 Each (inc. VAT)
1
AED 137.55
AED 137.55 Each (ex VAT)
AED 144.43
AED 144.43 Each (inc. VAT)
Stock information temporarily unavailable.
1
Technical Document
Specifications
Brand
BergquistProduct Type
Thermal Interface Sheet
Thickness
0.08in
Thermal Conductivity
0.9W/mK
Self-Adhesive
Yes
Hardness
Shore OO 40
Conductive Material
Polymer
Width
100 mm
Length
100mm
Standards/Approvals
RoHS
Colour
Green
Maximum Operating Temperature
125°C
Minimum Operating Temperature
-60°C
Country of Origin
United States
Product details
Gap Pad® 1000SF
Gap Pad® 1000SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling. Typical applications include digital disk drives/CD-ROM, automotive modules and fibre optics modules.
Thermal conductivity: 0.9 W/m-K
No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating
