Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 2.4W/m·K, Gap Pad 2500S20, 200 x 100mm

RS Stock No.: 752-4777Brand: BergquistManufacturers Part No.: GP2500S20-0.020-02-00-200x100
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Technical Document

Specifications

Dimensions

200 x 100mm

Thickness

0.02in

Length

200mm

Width

100mm

Thermal Conductivity

2.4W/m·K

Material

Gap Pad 2500S20

Self-Adhesive

Yes

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore OO 20

Material Trade Name

Gap Pad 2500S20

Operating Temperature Range

-60 → +200 °C

Country of Origin

United States

Product details

Bergquist Gap Pad® 2500S20

Bergquist Gap Pad® 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K. The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling and converting, added electrical isolation and tear resistance. Berqquist Gap Pad® 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting. The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Bergquist Gap Pad® 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling. Typical applications include between processors and heat sinks, between graphics chips and heat sinks, DVD and CD-ROM electronics cooling and areas where heat needs to be transferred to a frame, chassis or other type of heat spreader.

Thermal conductivity: 2.4 W/m-K
Low "S-Class" thermal resistance at ultra-low pressures
Ultra conformable, “gel-like” modulus
Designed for low-stress applications
Fibreglass reinforced for puncture, shear and tear resistance

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AED 282.45

Each (ex VAT)

AED 296.57

Each (inc VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 2.4W/m·K, Gap Pad 2500S20, 200 x 100mm

AED 282.45

Each (ex VAT)

AED 296.57

Each (inc VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.02in Thick, 2.4W/m·K, Gap Pad 2500S20, 200 x 100mm
Stock information temporarily unavailable.

Buy in bulk

quantityUnit price
1 - 9AED 282.45
10 - 24AED 254.45
25 - 49AED 240.35
50 - 99AED 234.45
100+AED 216.55

Technical Document

Specifications

Dimensions

200 x 100mm

Thickness

0.02in

Length

200mm

Width

100mm

Thermal Conductivity

2.4W/m·K

Material

Gap Pad 2500S20

Self-Adhesive

Yes

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore OO 20

Material Trade Name

Gap Pad 2500S20

Operating Temperature Range

-60 → +200 °C

Country of Origin

United States

Product details

Bergquist Gap Pad® 2500S20

Bergquist Gap Pad® 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K. The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling and converting, added electrical isolation and tear resistance. Berqquist Gap Pad® 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting. The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Bergquist Gap Pad® 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling. Typical applications include between processors and heat sinks, between graphics chips and heat sinks, DVD and CD-ROM electronics cooling and areas where heat needs to be transferred to a frame, chassis or other type of heat spreader.

Thermal conductivity: 2.4 W/m-K
Low "S-Class" thermal resistance at ultra-low pressures
Ultra conformable, “gel-like” modulus
Designed for low-stress applications
Fibreglass reinforced for puncture, shear and tear resistance