Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
AED 184.74
AED 184.74 Each (ex VAT)
AED 193.98
AED 193.98 Each (inc. VAT)
1
AED 184.74
AED 184.74 Each (ex VAT)
AED 193.98
AED 193.98 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | AED 184.74 |
| 10 - 19 | AED 177.41 |
| 20 - 49 | AED 172.16 |
| 50+ | AED 160.13 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
