Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
AED 197.09
AED 197.09 Each (ex VAT)
AED 206.94
AED 206.94 Each (inc. VAT)
1
AED 197.09
AED 197.09 Each (ex VAT)
AED 206.94
AED 206.94 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | AED 197.09 |
| 10 - 19 | AED 189.23 |
| 20 - 49 | AED 183.29 |
| 50+ | AED 167.56 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
