Technical Document
Specifications
Brand
HenkelLead Free
Yes
Trade Name
LOCTITE HF212 90iSC DAP
Package Type
Jar
Package Size
500g
Country of Origin
Hungary
Product details
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Solder Paste - Lead Free
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P.O.A.
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Technical Document
Specifications
Brand
HenkelLead Free
Yes
Trade Name
LOCTITE HF212 90iSC DAP
Package Type
Jar
Package Size
500g
Country of Origin
Hungary
Product details
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies