Technical Document
Specifications
Brand
HiroseNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
2
Pitch
0.5mm
Current
300mA
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
1.5mm
Connector System
Board-to-Board, Board-to-FPC
Voltage
50V
Series
DF23
Minimum Operating Temperature
-35°C
Row Pitch
4.4mm
Contact Gender
Female
Maximum Operating Temperature
85°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Country of Origin
Japan
Product details
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment
Stock information temporarily unavailable.
AED 41.73
AED 4.173 Each (In a Pack of 10) (ex VAT)
AED 43.82
AED 4.382 Each (In a Pack of 10) (inc. VAT)
10
AED 41.73
AED 4.173 Each (In a Pack of 10) (ex VAT)
AED 43.82
AED 4.382 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 190 | AED 4.173 | AED 41.73 |
| 200 - 740 | AED 3.852 | AED 38.52 |
| 750 - 2990 | AED 3.21 | AED 32.10 |
| 3000+ | AED 2.514 | AED 25.14 |
Technical Document
Specifications
Brand
HiroseNumber of Contacts
30
Product Type
PCB Socket
Number of Rows
2
Pitch
0.5mm
Current
300mA
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Stacking Height
1.5mm
Connector System
Board-to-Board, Board-to-FPC
Voltage
50V
Series
DF23
Minimum Operating Temperature
-35°C
Row Pitch
4.4mm
Contact Gender
Female
Maximum Operating Temperature
85°C
Contact Material
Copper
Contact Plating
Gold
Standards/Approvals
No
Country of Origin
Japan
Product details
Hirose DF23 series
Hirose DF23 series 0.5mm Pitch Low-Profile Board-to-Board / Board-to-FPC Connectors
Features and Benefits
• 1.5 mm board-to-board distance
• Click sensation
• High contact reliability
• Large self-alignment
• Board placement with automatic equipment


