MG Chemicals 8329TCS Liquid Adhesive, 6 ml
Technical Document
Specifications
Brand
MG ChemicalsAdhesive Type
Conductive Adhesive
Trade Name
8329TCS
Application
Thermal Management
Material Compatibility
Metal, Plastic
Product Form
Liquid
Package Type
Syringe
Package Size
6 ml
Cure Time
20 min
Maximum Operating Temperature
+200°C
Operating Temperature Range
-70 → +200 °C
Odour
Slight
Specific Gravity
2.41
Minimum Operating Temperature
-70°C
Country of Origin
Canada
Product details
MG Chemicals 8329 Slow Cure Conductive Adhesives
The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.
Feature and Benefits
Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Typical Applications
Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat
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Technical Document
Specifications
Brand
MG ChemicalsAdhesive Type
Conductive Adhesive
Trade Name
8329TCS
Application
Thermal Management
Material Compatibility
Metal, Plastic
Product Form
Liquid
Package Type
Syringe
Package Size
6 ml
Cure Time
20 min
Maximum Operating Temperature
+200°C
Operating Temperature Range
-70 → +200 °C
Odour
Slight
Specific Gravity
2.41
Minimum Operating Temperature
-70°C
Country of Origin
Canada
Product details
MG Chemicals 8329 Slow Cure Conductive Adhesives
The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.
Feature and Benefits
Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Typical Applications
Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat