Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Current Rating
3.0A
Series Number
55932
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
AED 13.90
AED 1.39 Each (In a Pack of 10) (ex VAT)
AED 14.60
AED 1.46 Each (In a Pack of 10) (inc. VAT)
Standard
10
AED 13.90
AED 1.39 Each (In a Pack of 10) (ex VAT)
AED 14.60
AED 1.46 Each (In a Pack of 10) (inc. VAT)
Standard
10
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
10 - 240 | AED 1.39 | AED 13.90 |
250 - 990 | AED 1.03 | AED 10.30 |
1000 - 4990 | AED 0.824 | AED 8.24 |
5000 - 9990 | AED 0.824 | AED 8.24 |
10000+ | AED 0.772 | AED 7.72 |
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Current Rating
3.0A
Series Number
55932
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Vertical Header with Boss
A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.