Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
12
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55959
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Stock information temporarily unavailable.
AED 39.06
AED 3.906 Each (In a Pack of 10) (ex VAT)
AED 41.01
AED 4.101 Each (In a Pack of 10) (inc. VAT)
Standard
10
AED 39.06
AED 3.906 Each (In a Pack of 10) (ex VAT)
AED 41.01
AED 4.101 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
Standard
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 190 | AED 3.906 | AED 39.06 |
| 200 - 740 | AED 3.37 | AED 33.70 |
| 750 - 2990 | AED 3.05 | AED 30.50 |
| 3000 - 5990 | AED 2.889 | AED 28.89 |
| 6000+ | AED 2.782 | AED 27.82 |
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
12
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55959
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.


