Technical Documents
Specifications
Brand
PanasonicProduct Type
Evaluation Board
Kit Classification
Evaluation Board
RF Technology
Bluetooth
Technology
Bluetooth
For Use With
Wireless Connectivity, Smart Home/Building, Medical Devices, Industrial IoT, Beacons
Featured Device
PAN1326C2
Maximum Frequency
2.4GHz
Standards/Approvals
IEEE 802.15.4
Country of Origin
Germany
Product Details
The Panasonic Host Controlled Interface (HCI) Bluetooth RF module brings Texas Instruments seventh generation Bluetooth core integrated circuit, the CC2564, to an easy to use module format. It is Bluetooth 4.2 compliant and it offers best in class RF performance with about twice the range of other Bluetooth LE solutions. Tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments based Bluetooth HCI modules.
Stock information temporarily unavailable.
AED 278.79
AED 278.79 Each (ex VAT)
AED 292.73
AED 292.73 Each (inc. VAT)
1
AED 278.79
AED 278.79 Each (ex VAT)
AED 292.73
AED 292.73 Each (inc. VAT)
Stock information temporarily unavailable.
1
Technical Documents
Specifications
Brand
PanasonicProduct Type
Evaluation Board
Kit Classification
Evaluation Board
RF Technology
Bluetooth
Technology
Bluetooth
For Use With
Wireless Connectivity, Smart Home/Building, Medical Devices, Industrial IoT, Beacons
Featured Device
PAN1326C2
Maximum Frequency
2.4GHz
Standards/Approvals
IEEE 802.15.4
Country of Origin
Germany
Product Details
The Panasonic Host Controlled Interface (HCI) Bluetooth RF module brings Texas Instruments seventh generation Bluetooth core integrated circuit, the CC2564, to an easy to use module format. It is Bluetooth 4.2 compliant and it offers best in class RF performance with about twice the range of other Bluetooth LE solutions. Tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments based Bluetooth HCI modules.