Technical Documents
Specifications
Brand
PanasonicProduct Type
Evaluation Board
Kit Classification
Evaluation Board
RF Technology
Bluetooth
Technology
Bluetooth
For Use With
CE, Bluetooth QDID, IC, FCC
Featured Device
PAN1316C
Kit Name
Evaluation Board
Maximum Frequency
2.4GHz
Standards/Approvals
IEEE 802.15.4
Country of Origin
Germany
Product Details
The Panasonic Host Controlled Interface (HCI) Bluetooth Radio Frequency (RF) module brings Texas Instruments, seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to-use module format. It is Bluetooth 5.1 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy (LE) solutions. Tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments based Bluetooth HCI modules.
Stock information temporarily unavailable.
AED 192.44
AED 192.44 Each (ex VAT)
AED 202.06
AED 202.06 Each (inc. VAT)
1
AED 192.44
AED 192.44 Each (ex VAT)
AED 202.06
AED 202.06 Each (inc. VAT)
Stock information temporarily unavailable.
1
Technical Documents
Specifications
Brand
PanasonicProduct Type
Evaluation Board
Kit Classification
Evaluation Board
RF Technology
Bluetooth
Technology
Bluetooth
For Use With
CE, Bluetooth QDID, IC, FCC
Featured Device
PAN1316C
Kit Name
Evaluation Board
Maximum Frequency
2.4GHz
Standards/Approvals
IEEE 802.15.4
Country of Origin
Germany
Product Details
The Panasonic Host Controlled Interface (HCI) Bluetooth Radio Frequency (RF) module brings Texas Instruments, seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to-use module format. It is Bluetooth 5.1 compliant and it offers best-in-class RF performance with about twice the range of other Bluetooth Low Energy (LE) solutions. Tiny footprint technology has produced a module of only 85.5 mm². The module is designed to accommodate PCBs pad pitch of 1.3 mm and as few as two layers for easy implementation and manufacturing. The module has been designed to be 100 percent pin-compatible with previous generations of Texas Instruments based Bluetooth HCI modules.