Phoenix Contact MKDSN 2.5/ 3-5.08 HT BK Series PCB Terminal Block, 5.08mm Pitch, Through Hole Mount, Solder Termination

RS Stock No.: 467-0401Brand: Phoenix ContactManufacturers Part No.: 1985959
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Technical Document

Specifications

Pitch

5.08mm

Mounting Type

Through Hole

Termination Method

Solder

Current Rating

16A

Colour

Black

Voltage Rating

630 V

Series

MKDSN 2.5/ 3-5.08 HT BK

Material

Nylon

Country of Origin

France

Product details

Phoenix Contact COMBICON MKDS 5.08mm High Temperature PCB Terminal Blocks

High temperature PCB terminal blocks are reflow solder tolerable and enable a greater proportion of a PCB to be populated and reflow soldered in one operation. Recommended as being suitable for temperature profiles based on EN 61 760-01. When used in reflow oven it is recommended that these components are heat treated at +125°C for 48 hours prior to use.

Features and Benefits

• Removes the necessity for costly subsequent soldering operations
• Through-hole fixing offers high mechanical stability
• Made from Liquid Crystal Polymer
• Latching on side of terminal enables various numbers of positions to be combined

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AED 3.60

Each (In a Pack of 5) (ex VAT)

AED 3.78

Each (In a Pack of 5) (inc. VAT)

Phoenix Contact MKDSN 2.5/ 3-5.08 HT BK Series PCB Terminal Block, 5.08mm Pitch, Through Hole Mount, Solder Termination

AED 3.60

Each (In a Pack of 5) (ex VAT)

AED 3.78

Each (In a Pack of 5) (inc. VAT)

Phoenix Contact MKDSN 2.5/ 3-5.08 HT BK Series PCB Terminal Block, 5.08mm Pitch, Through Hole Mount, Solder Termination
Stock information temporarily unavailable.

Technical Document

Specifications

Pitch

5.08mm

Mounting Type

Through Hole

Termination Method

Solder

Current Rating

16A

Colour

Black

Voltage Rating

630 V

Series

MKDSN 2.5/ 3-5.08 HT BK

Material

Nylon

Country of Origin

France

Product details

Phoenix Contact COMBICON MKDS 5.08mm High Temperature PCB Terminal Blocks

High temperature PCB terminal blocks are reflow solder tolerable and enable a greater proportion of a PCB to be populated and reflow soldered in one operation. Recommended as being suitable for temperature profiles based on EN 61 760-01. When used in reflow oven it is recommended that these components are heat treated at +125°C for 48 hours prior to use.

Features and Benefits

• Removes the necessity for costly subsequent soldering operations
• Through-hole fixing offers high mechanical stability
• Made from Liquid Crystal Polymer
• Latching on side of terminal enables various numbers of positions to be combined