Technical Document
Specifications
Brand
SPREADFASTProduct Type
Heatsink
For Use With
Universal Square Ceramic
Length
60mm
Width
60mm
Height
15mm
Fastening
Adhesive, Screw
Thermal Resistance
2.6, 4.7°C/W
Colour
White
Series
Circular Pin Fin
Standards/Approvals
RoHS
Material
Aluminium Oxide
Country of Origin
China
Product details
Spreadfast SF-CHS Series Round Pin Ceramic Heatsink
Spreadfast SF-CHS series of round pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
Stock information temporarily unavailable.
AED 54.57
AED 54.57 Each (ex VAT)
AED 57.30
AED 57.30 Each (inc. VAT)
1
AED 54.57
AED 54.57 Each (ex VAT)
AED 57.30
AED 57.30 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | AED 54.57 |
| 10 - 24 | AED 51.41 |
| 25 - 49 | AED 50.18 |
| 50 - 99 | AED 49.27 |
| 100+ | AED 46.22 |
Technical Document
Specifications
Brand
SPREADFASTProduct Type
Heatsink
For Use With
Universal Square Ceramic
Length
60mm
Width
60mm
Height
15mm
Fastening
Adhesive, Screw
Thermal Resistance
2.6, 4.7°C/W
Colour
White
Series
Circular Pin Fin
Standards/Approvals
RoHS
Material
Aluminium Oxide
Country of Origin
China
Product details
Spreadfast SF-CHS Series Round Pin Ceramic Heatsink
Spreadfast SF-CHS series of round pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
