TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination
Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Country of Origin
China
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Stock information temporarily unavailable.
Please check again later.
AED 1,344.00
AED 22.40 Each (In a Tube of 60) (ex VAT)
AED 1,411.20
AED 23.52 Each (In a Tube of 60) (inc. VAT)
60
AED 1,344.00
AED 22.40 Each (In a Tube of 60) (ex VAT)
AED 1,411.20
AED 23.52 Each (In a Tube of 60) (inc. VAT)
60
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Country of Origin
China
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products