Vishay 100μF Surface Mount Polymer Capacitor, 6.3V dc
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
100µF
Voltage
6.3V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Maximum Operating Temperature
+105°C
Height
1.6mm
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
63 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
AED 2,678.00
AED 1.339 Each (On a Reel of 2000) (ex VAT)
AED 2,811.90
AED 1.406 Each (On a Reel of 2000) (inc. VAT)
2000
AED 2,678.00
AED 1.339 Each (On a Reel of 2000) (ex VAT)
AED 2,811.90
AED 1.406 Each (On a Reel of 2000) (inc. VAT)
2000
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Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
100µF
Voltage
6.3V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
70mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Maximum Operating Temperature
+105°C
Height
1.6mm
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
63 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets