Technical Document
Specifications
Brand
VPG Foil ResistorsResistance
1kΩ
Technology
Metal Foil
Package/Case
0805 (2012M)
Tolerance
±0.01%
Power Rating
0.1W
Temperature Coefficient
±0.2ppm/°C
Series
VFCP
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+125°C
Product details
VFCP Series Ultra High Precision Z Foil SMD Flip Chip Resistor
VFCP Series ultra high precision Z Foil surface mount chip resistors offering proven reliability and excellent stability under different environmental conditions. The VFCPs flip chip design saves more than 35% of PCB space compared to a SMD chip with wraparound connections. Applications for the VFCP resistor include; Automatic test equipment (ATE); high precision instrumentation; laboratory, industrial and medical; Audio; EB applications; Military and Space; Airborne; Down-hole instrumentation; Communication
Surface Mount - 1506
AED 92.14
AED 92.14 Each (ex VAT)
AED 96.75
AED 96.75 Each (inc. VAT)
Standard
1
AED 92.14
AED 92.14 Each (ex VAT)
AED 96.75
AED 96.75 Each (inc. VAT)
Standard
1
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price |
|---|---|
| 1 - 4 | AED 92.14 |
| 5 - 9 | AED 89.51 |
| 10 - 24 | AED 87.10 |
| 25+ | AED 84.84 |
Technical Document
Specifications
Brand
VPG Foil ResistorsResistance
1kΩ
Technology
Metal Foil
Package/Case
0805 (2012M)
Tolerance
±0.01%
Power Rating
0.1W
Temperature Coefficient
±0.2ppm/°C
Series
VFCP
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
+125°C
Product details
VFCP Series Ultra High Precision Z Foil SMD Flip Chip Resistor
VFCP Series ultra high precision Z Foil surface mount chip resistors offering proven reliability and excellent stability under different environmental conditions. The VFCPs flip chip design saves more than 35% of PCB space compared to a SMD chip with wraparound connections. Applications for the VFCP resistor include; Automatic test equipment (ATE); high precision instrumentation; laboratory, industrial and medical; Audio; EB applications; Military and Space; Airborne; Down-hole instrumentation; Communication


