Technical Document
Specifications
Brand
WinslowNumber Of Contacts
6
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
7.54mm
Width
10.14mm
Depth
3mm
Dimensions
7.54 x 10.14 x 3mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
Glass Fibre Reinforced PET
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
AED 221.81
AED 3.412 Each (In a Tube of 65) (ex VAT)
AED 232.90
AED 3.583 Each (In a Tube of 65) (inc. VAT)
65
AED 221.81
AED 3.412 Each (In a Tube of 65) (ex VAT)
AED 232.90
AED 3.583 Each (In a Tube of 65) (inc. VAT)
65
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
65 - 1560 | AED 3.412 | AED 221.81 |
1625 - 4810 | AED 3.045 | AED 197.92 |
4875 - 12935 | AED 2.73 | AED 177.45 |
13000 - 25935 | AED 2.362 | AED 153.56 |
26000+ | AED 2.205 | AED 143.32 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
6
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
7.54mm
Width
10.14mm
Depth
3mm
Dimensions
7.54 x 10.14 x 3mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
Glass Fibre Reinforced PET
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).