Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
10.14mm
Dimensions
35.48 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
AED 146.36
AED 10.454 Each (In a Tube of 14) (ex VAT)
AED 153.68
AED 10.977 Each (In a Tube of 14) (inc. VAT)
14
AED 146.36
AED 10.454 Each (In a Tube of 14) (ex VAT)
AED 153.68
AED 10.977 Each (In a Tube of 14) (inc. VAT)
14
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
14 - 336 | AED 10.454 | AED 146.36 |
350 - 1036 | AED 9.424 | AED 131.94 |
1050 - 2786 | AED 8.394 | AED 117.52 |
2800 - 5586 | AED 7.313 | AED 102.38 |
5600+ | AED 6.85 | AED 95.89 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
10.14mm
Dimensions
35.48 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).