Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
17.66mm
Dimensions
35.48 x 3.5 x 17.66mm
Housing Material
PBT
Contact Material
Beryllium Copper
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
AED 157.29
AED 11.235 Each (In a Tube of 14) (ex VAT)
AED 165.15
AED 11.797 Each (In a Tube of 14) (inc. VAT)
14
AED 157.29
AED 11.235 Each (In a Tube of 14) (ex VAT)
AED 165.15
AED 11.797 Each (In a Tube of 14) (inc. VAT)
14
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Tube |
|---|---|---|
| 14 - 336 | AED 11.235 | AED 157.29 |
| 350 - 1036 | AED 10.815 | AED 151.41 |
| 1050 - 2786 | AED 10.448 | AED 146.26 |
| 2800 - 5586 | AED 9.975 | AED 139.65 |
| 5600+ | AED 9.608 | AED 134.50 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
17.66mm
Dimensions
35.48 x 3.5 x 17.66mm
Housing Material
PBT
Contact Material
Beryllium Copper
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).


