Technical Document
Specifications
Brand
WinslowNumber Of Contacts
32
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
40.56mm
Width
3.5mm
Depth
17.66mm
Dimensions
40.56 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
AED 156.87
AED 13.072 Each (In a Tube of 12) (ex VAT)
AED 164.71
AED 13.726 Each (In a Tube of 12) (inc. VAT)
12
AED 156.87
AED 13.072 Each (In a Tube of 12) (ex VAT)
AED 164.71
AED 13.726 Each (In a Tube of 12) (inc. VAT)
12
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Tube |
|---|---|---|
| 12 - 288 | AED 13.072 | AED 156.87 |
| 300 - 888 | AED 11.76 | AED 141.12 |
| 900 - 2388 | AED 10.50 | AED 126.00 |
| 2400 - 4788 | AED 9.188 | AED 110.25 |
| 4800+ | AED 8.558 | AED 102.69 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
32
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
40.56mm
Width
3.5mm
Depth
17.66mm
Dimensions
40.56 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).


