Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
AED 154.88
AED 15.488 Each (In a Tube of 10) (ex VAT)
AED 162.62
AED 16.262 Each (In a Tube of 10) (inc. VAT)
10
AED 154.88
AED 15.488 Each (In a Tube of 10) (ex VAT)
AED 162.62
AED 16.262 Each (In a Tube of 10) (inc. VAT)
10
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Tube |
|---|---|---|
| 10 - 240 | AED 15.488 | AED 154.88 |
| 250 - 740 | AED 13.912 | AED 139.12 |
| 750 - 1990 | AED 12.39 | AED 123.90 |
| 2000 - 3990 | AED 10.815 | AED 108.15 |
| 4000+ | AED 10.185 | AED 101.85 |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).


