Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
32 Pin Female SOP
End 2
32 Pin Male DIP
End 1 Number of Contacts
32
End 2 Number of Contacts
32
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 511.09
AED 102.218 Each (In a Pack of 5) (ex VAT)
AED 536.64
AED 107.329 Each (In a Pack of 5) (inc. VAT)
5
AED 511.09
AED 102.218 Each (In a Pack of 5) (ex VAT)
AED 536.64
AED 107.329 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | AED 102.218 | AED 511.09 |
| 125 - 370 | AED 92.032 | AED 460.16 |
| 375 - 995 | AED 81.795 | AED 408.98 |
| 1000 - 1995 | AED 71.558 | AED 357.79 |
| 2000+ | AED 66.412 | AED 332.06 |
Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
32 Pin Female SOP
End 2
32 Pin Male DIP
End 1 Number of Contacts
32
End 2 Number of Contacts
32
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


