Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 232.31
AED 46.462 Each (In a Pack of 5) (ex VAT)
AED 243.93
AED 48.785 Each (In a Pack of 5) (inc. VAT)
5
AED 232.31
AED 46.462 Each (In a Pack of 5) (ex VAT)
AED 243.93
AED 48.785 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | AED 46.462 | AED 232.31 |
125 - 370 | AED 41.79 | AED 208.95 |
375 - 995 | AED 37.118 | AED 185.59 |
1000 - 1995 | AED 32.498 | AED 162.49 |
2000+ | AED 30.188 | AED 150.94 |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.