Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 24
End 2
DIP 24
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 437.06
AED 87.412 Each (In a Pack of 5) (ex VAT)
AED 458.91
AED 91.783 Each (In a Pack of 5) (inc. VAT)
5
AED 437.06
AED 87.412 Each (In a Pack of 5) (ex VAT)
AED 458.91
AED 91.783 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | AED 87.412 | AED 437.06 |
| 125 - 370 | AED 78.645 | AED 393.22 |
| 375 - 995 | AED 69.93 | AED 349.65 |
| 1000 - 1995 | AED 61.162 | AED 305.81 |
| 2000+ | AED 56.805 | AED 284.02 |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 24
End 2
DIP 24
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


