Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 494.02
AED 98.805 Each (In a Pack of 5) (ex VAT)
AED 518.72
AED 103.745 Each (In a Pack of 5) (inc. VAT)
5
AED 494.02
AED 98.805 Each (In a Pack of 5) (ex VAT)
AED 518.72
AED 103.745 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | AED 98.805 | AED 494.02 |
125 - 370 | AED 88.882 | AED 444.41 |
375 - 995 | AED 79.012 | AED 395.06 |
1000 - 1995 | AED 69.142 | AED 345.71 |
2000+ | AED 64.208 | AED 321.04 |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.