Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
MSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
MSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 321.04
AED 64.208 Each (In a Pack of 5) (ex VAT)
AED 337.09
AED 67.418 Each (In a Pack of 5) (inc. VAT)
5
AED 321.04
AED 64.208 Each (In a Pack of 5) (ex VAT)
AED 337.09
AED 67.418 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | AED 64.208 | AED 321.04 |
| 125 - 370 | AED 57.802 | AED 289.01 |
| 375 - 995 | AED 51.345 | AED 256.72 |
| 1000 - 1995 | AED 44.94 | AED 224.70 |
| 2000+ | AED 41.738 | AED 208.69 |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
MSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
MSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


