Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
TSSOP 20
End 2
DIP 20
End 1 Number of Contacts
20
End 2 Number of Contacts
20
End 1 Type
TSSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 261.98
AED 52.395 Each (In a Pack of 5) (ex VAT)
AED 275.08
AED 55.015 Each (In a Pack of 5) (inc. VAT)
5
AED 261.98
AED 52.395 Each (In a Pack of 5) (ex VAT)
AED 275.08
AED 55.015 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | AED 52.395 | AED 261.98 |
| 125 - 370 | AED 47.145 | AED 235.72 |
| 375 - 995 | AED 41.895 | AED 209.48 |
| 1000 - 1995 | AED 36.698 | AED 183.49 |
| 2000+ | AED 34.072 | AED 170.36 |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
TSSOP 20
End 2
DIP 20
End 1 Number of Contacts
20
End 2 Number of Contacts
20
End 1 Type
TSSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


