Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 265.12
AED 53.025 Each (In a Pack of 5) (ex VAT)
AED 278.38
AED 55.676 Each (In a Pack of 5) (inc. VAT)
5
AED 265.12
AED 53.025 Each (In a Pack of 5) (ex VAT)
AED 278.38
AED 55.676 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | AED 53.025 | AED 265.12 |
125 - 370 | AED 47.722 | AED 238.61 |
375 - 995 | AED 42.42 | AED 212.10 |
1000 - 1995 | AED 37.118 | AED 185.59 |
2000+ | AED 34.44 | AED 172.20 |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.