Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 102.64
AED 20.528 Each (In a Pack of 5) (ex VAT)
AED 107.77
AED 21.554 Each (In a Pack of 5) (inc. VAT)
5
AED 102.64
AED 20.528 Each (In a Pack of 5) (ex VAT)
AED 107.77
AED 21.554 Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
Stock information temporarily unavailable.
Quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | AED 20.528 | AED 102.64 |
125 - 370 | AED 18.48 | AED 92.40 |
375 - 995 | AED 16.38 | AED 81.90 |
1000 - 1995 | AED 14.385 | AED 71.92 |
2000+ | AED 13.335 | AED 66.68 |
Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
6 Pin Female SOP
End 2
6 Pin Male DIP
End 1 Number of Contacts
6
End 2 Number of Contacts
6
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.