Technical Document
Specifications
Brand
WinslowPitch
0.63 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 385.88
AED 77.175 Each (In a Pack of 5) (ex VAT)
AED 405.17
AED 81.034 Each (In a Pack of 5) (inc. VAT)
5
AED 385.88
AED 77.175 Each (In a Pack of 5) (ex VAT)
AED 405.17
AED 81.034 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | AED 77.175 | AED 385.88 |
125 - 370 | AED 69.458 | AED 347.29 |
375 - 995 | AED 61.74 | AED 308.70 |
1000 - 1995 | AED 54.022 | AED 270.11 |
2000+ | AED 50.138 | AED 250.69 |
Technical Document
Specifications
Brand
WinslowPitch
0.63 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.