Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 186.64
AED 37.328 Each (In a Pack of 5) (ex VAT)
AED 195.97
AED 39.194 Each (In a Pack of 5) (inc. VAT)
5
AED 186.64
AED 37.328 Each (In a Pack of 5) (ex VAT)
AED 195.97
AED 39.194 Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
Stock information temporarily unavailable.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | AED 37.328 | AED 186.64 |
| 125 - 370 | AED 33.60 | AED 168.00 |
| 375 - 995 | AED 29.82 | AED 149.10 |
| 1000 - 1995 | AED 26.145 | AED 130.72 |
| 2000+ | AED 24.255 | AED 121.28 |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


