Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 20
End 2
DIP 20
End 1 Number of Contacts
20
End 2 Number of Contacts
20
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
AED 378.79
AED 75.758 Each (In a Pack of 5) (ex VAT)
AED 397.73
AED 79.546 Each (In a Pack of 5) (inc. VAT)
5
AED 378.79
AED 75.758 Each (In a Pack of 5) (ex VAT)
AED 397.73
AED 79.546 Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | AED 75.758 | AED 378.79 |
| 125 - 370 | AED 68.198 | AED 340.99 |
| 375 - 995 | AED 60.638 | AED 303.19 |
| 1000 - 1995 | AED 53.025 | AED 265.12 |
| 2000+ | AED 49.245 | AED 246.22 |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 20
End 2
DIP 20
End 1 Number of Contacts
20
End 2 Number of Contacts
20
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


