DIL Sockets

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Part Details Brand Number Of Contacts Mounting Type Pin Type Pitch Row Width Frame Type Termination Method Contact Plating Current Rating Orientation Length Width Depth Dimensions Contact Material Housing Material Series Voltage Rating Minimum Operating Temperature Maximum Operating Temperature
HARWIN D2 2.54mm Pitch Vertical 8 Way, PCB Mount Standard pin Open Frame IC Dip Socket, 1A HARWIN 8 PCB Mount Standard 2.54mm 7.62mm Open Frame Solder Gold 1A Vertical 10.1mm 10.02mm 4.2mm 10.1 x 10.02 x 4.2mm Beryllium Copper Plastic D2 100 V ac, 150 V dc -55°C +125°C
TE Connectivity 1-2199298 2.54mm Pitch Straight 14 Way, Through Hole Standard pin Ladder IC Dip Socket, 1A TE Connectivity 14 Through Hole Standard 2.54mm 7.62mm Ladder Solder Tin over Nickel 1A Straight 17.78mm 10mm 5.1mm 17.78 x 10 x 5.1mm Phosphor Bronze Glass Filled PBT, Thermoplastic 1-2199298 250 V ac/dc -40°C +105°C
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Stamped pin Closed Frame IC Dip Socket, 1A TE Connectivity 16 Through Hole Stamped 2.54mm 7.62mm Closed Frame Solder Tin 1A Vertical 20.32mm 5.1mm 10mm 20.32 x 5.1 x 10mm Phosphor Bronze PBT - 250 V ac -40°C +105°C
TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Standard pin Closed Frame IC Dip Socket TE Connectivity 16 Through Hole Standard 2.54mm 2.54mm Closed Frame Solder Gold - Vertical 20.32mm 10.16mm 4.57mm 20.32 x 10.16 x 4.57mm Beryllium Copper Thermoplastic - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 35.56mm 4.57mm 17.78mm 35.56 x 4.57 x 17.78mm Beryllium Copper PET - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Tin 3A Vertical 35.56mm 4.57mm 17.78mm 35.56 x 4.57 x 17.78mm Beryllium Copper PCT - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped pin Closed Frame IC Dip Socket TE Connectivity 32 Through Hole Stamped 2.54mm 15.24mm Closed Frame Solder Tin - Vertical 40.51mm 5.33mm 17.63mm 40.51 x 5.33 x 17.63mm Beryllium Copper Thermoplastic - - -55°C +105°C
TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 8 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Gold 3A Vertical 10.16mm 4.57mm 10.16mm 10.16 x 4.57 x 10.16mm Beryllium Copper PCT - - -55°C +105°C
TE Connectivity DIPLOMATE 800 2.54mm Pitch Vertical 32 Way, Through Hole Turned pin Open Frame IC Dip Socket, 3A TE Connectivity 32 Through Hole Turned 2.54mm 15.24mm Open Frame Solder Gold, Tin 3A Vertical 40.64mm 4.57mm 17.78mm 40.64 x 4.57 x 17.78mm Beryllium Copper PCT DIPLOMATE 800 - -55°C +105°C
TE Connectivity Economy 800 2.54mm Pitch Vertical 28 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 35.56mm 4.57mm 17.78mm 35.56 x 4.57 x 17.78mm Beryllium Copper PCT Economy 800 - -55°C +105°C
TE Connectivity Economy 800 2.54mm Pitch Vertical 28 Way, Through Hole Turned pin Open Frame IC Dip Socket, 3A TE Connectivity 28 Through Hole Turned 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 35.56mm 17.78mm 2.67mm 35.56 x 17.78 x 2.67mm Beryllium Copper PET Economy 800 - -55°C +105°C
TE Connectivity Economy 800 2.54mm Pitch Vertical 40 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 40 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 50.8mm 4.57mm 17.78mm 50.8 x 4.57 x 17.78mm Beryllium Copper PCT Economy 800 - -55°C +105°C
TE Connectivity Economy 800 2.54mm Pitch Vertical 40 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 3A TE Connectivity 40 Through Hole Stamped 2.54mm 15.24mm Open Frame Solder Gold 3A Vertical 50.8mm 17.78mm 2.67mm 50.8 x 17.78 x 2.67mm Beryllium Copper PET Economy 800 - -55°C +105°C
Winslow 2.54mm Pitch Vertical 22 Way, Through Hole Turned pin Open Frame IC Dip Socket, 5A Winslow 22 Through Hole Turned 2.54mm 10.16mm Open Frame Solder Gold, Tin 5A Vertical 27.86mm 4.6mm 12.68mm 27.86 x 4.6 x 12.68mm Beryllium Copper PBT - - -65°C +150°C
Winslow 2.54mm Pitch Vertical 8 Way, Through Hole Turned pin Open Frame IC Dip Socket, 5A Winslow 8 Through Hole Turned 2.54mm 7.62mm Open Frame Solder Gold, Tin 5A Vertical 10.08mm 4.6mm 10.14mm 10.08 x 4.6 x 10.14mm Beryllium Copper PBT - - -65°C +150°C
Winslow W3100 2.54mm Pitch Vertical 8 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 10A Winslow 8 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Tin 10A Vertical 10.03mm 4.5mm 10.14mm 10.03 x 4.5 x 10.14mm Phosphor Bronze PBT W3100 - -65°C +150°C
Winslow W3100 2.54mm Pitch Vertical 16 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 10A Winslow 16 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Tin 10A Vertical 20.19mm 4.5mm 10.14mm 20.19 x 4.5 x 10.14mm Phosphor Bronze PBT W3100 - -65°C +150°C
ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 1A ASSMANN WSW 8 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Tin 1A Vertical 10.16mm 10.16mm 5.1mm 10.16 x 10.16 x 5.1mm Phosphor Bronze PBT - 60 V ac -55°C +85°C
Winslow W3100 2.54mm Pitch Vertical 6 Way, Through Hole Stamped pin Open Frame IC Dip Socket, 10A Winslow 6 Through Hole Stamped 2.54mm 7.62mm Open Frame Solder Tin 10A Vertical 7.49mm 4.5mm 10.14mm 7.49 x 4.5 x 10.14mm Phosphor Bronze PBT W3100 - -65°C +150°C
Winslow 2.54mm Pitch Vertical 6 Way, Through Hole Turned pin Open Frame IC Dip Socket, 5A Winslow 6 Through Hole Turned 2.54mm 7.62mm Open Frame Solder Tin Lead Alloy 5A Vertical 7.54mm 4.6mm 10.14mm 7.54 x 4.6 x 10.14mm Beryllium Copper PBT - - -65°C +150°C
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