RS PRO, 33Ω 50W Wire Wound Chassis Mount Resistor ±5%
Technical Document
Specifications
Brand
RS ProResistance
33Ω
Power Rating
50W
Package/Case
Aluminium Housed
Tolerance
±5%
Technology
Wire Wound
Termination Style
Axial
Maximum Operating Temperature
+200°C
Minimum Temperature Coefficient
-100ppm/°C
Maximum Temperature Coefficient
+100ppm/°C
Dimensions
72.5 x 29.7 x 14.8mm
Overall Width
29.7mm
Overall Height
14.8mm
Overall Length
72.5mm
Country of Origin
United Kingdom
Product details
RS Pro 50 W Aluminium Housed Wirewound Resistors
RS Pro 50 W Aluminium housed power resistors which are manufactured to be compliant with the requirements of a MIL 18546, IEC 115 and are RoHS compliant.
Features
Compact size for Power rating
High Power to volume
Wound to maximise High Pulse Capability
Applications
Designed for direct heatsink mounting with thermal compound to achieve maximum performance.
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AED 14.75
Each (In a Pack of 5) (ex VAT)
AED 15.488
Each (In a Pack of 5) (inc. VAT)
5
AED 14.75
Each (In a Pack of 5) (ex VAT)
AED 15.488
Each (In a Pack of 5) (inc. VAT)
5
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 245 | AED 14.75 | AED 73.75 |
| 250 - 495 | AED 14.60 | AED 73.00 |
| 500 - 1245 | AED 14.45 | AED 72.25 |
| 1250+ | AED 14.25 | AED 71.25 |
Technical Document
Specifications
Brand
RS ProResistance
33Ω
Power Rating
50W
Package/Case
Aluminium Housed
Tolerance
±5%
Technology
Wire Wound
Termination Style
Axial
Maximum Operating Temperature
+200°C
Minimum Temperature Coefficient
-100ppm/°C
Maximum Temperature Coefficient
+100ppm/°C
Dimensions
72.5 x 29.7 x 14.8mm
Overall Width
29.7mm
Overall Height
14.8mm
Overall Length
72.5mm
Country of Origin
United Kingdom
Product details
RS Pro 50 W Aluminium Housed Wirewound Resistors
RS Pro 50 W Aluminium housed power resistors which are manufactured to be compliant with the requirements of a MIL 18546, IEC 115 and are RoHS compliant.
Features
Compact size for Power rating
High Power to volume
Wound to maximise High Pulse Capability
Applications
Designed for direct heatsink mounting with thermal compound to achieve maximum performance.