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RS PRO Heatsink, Universal Rectangular Alu, 0.24°C/W, 100 x 250 x 30mm, PCB Mount

RS Stock No.: 903-3172Brand: RS PRO
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Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

100mm

Width

250mm

Height

30mm

Dimensions

100 x 250 x 30mm

Thermal Resistance

0.24°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Country of Origin

United Kingdom

Product details

Heat Sink 132AB Series, 250mm Wide x 30mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

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Stock information temporarily unavailable.

AED 223.05

Each (ex VAT)

AED 234.20

Each (inc. VAT)

RS PRO Heatsink, Universal Rectangular Alu, 0.24°C/W, 100 x 250 x 30mm, PCB Mount

AED 223.05

Each (ex VAT)

AED 234.20

Each (inc. VAT)

RS PRO Heatsink, Universal Rectangular Alu, 0.24°C/W, 100 x 250 x 30mm, PCB Mount
Stock information temporarily unavailable.

Buy in bulk

quantityUnit price
1 - 9AED 223.05
10 - 24AED 210.85
25 - 49AED 205.85
50+AED 202.45

Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

100mm

Width

250mm

Height

30mm

Dimensions

100 x 250 x 30mm

Thermal Resistance

0.24°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Country of Origin

United Kingdom

Product details

Heat Sink 132AB Series, 250mm Wide x 30mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.