Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Stock information temporarily unavailable.
Please check again later.
AED 7.45
Each (In a Pack of 5) (ex VAT)
AED 7.822
Each (In a Pack of 5) (inc VAT)
5
AED 7.45
Each (In a Pack of 5) (ex VAT)
AED 7.822
Each (In a Pack of 5) (inc VAT)
5
Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C