High Density Connector

Orientation

Straight (44)

Right Angle (23)

Top Entry (14)

Contact Material

Copper Alloy (38)

Brass (22)

Copper (6)

Phosphor Bronze (2)

Connector Gender

Female (46)

Male (20)

Termination Type

Solder (45)

Crimp (18)

IDC (1)

Contact Plating

Gold (27)

Gold over Nickel (15)

Gold Flash (7)

Tin (6)

Palladium over Nickel (2)

Tin, Nickel, Gold (2)

Gold Plated (1)

Tin, Gold (1)

Mount Type

Cable (17)

Through Hole (17)

Surface (14)

Panel (6)

Panel Mount (5)

Plug-in (2)

Connector Type D

High Density (55)

D-Sub (4)

Current

5A (19)

2A (18)

3A (8)

1A (3)

2.5A (3)

6.5A (2)

7.5A (2)

500mA (1)

Maximum Operating Temperature

105°C (35)

125°C (13)

85°C (8)

Minimum Operating Temperature

-55°C (48)

-40°C (7)

-10°C (1)

Contact Gender

Female (32)

Male (23)

Voltage

250 V (15)

1000 V (10)

1 kV (5)

250.0 V (4)

1.0 kV (3)

200 V (1)

Colour

Grey (6)

Silver (5)

Blue (4)

Natural (4)

Red (4)

Black (1)

Pink (1)

Yellow (1)

Number of Rows

1 (14)

2 (3)

4 (2)

Input Current Type

DC (15)

AC (2)

Isolation Voltage

3750 Vrms (14)

2.5 kVrms (2)

3.75 kVrms (1)

Maximum Current Transfer Ratio

600% (9)

400% (6)

300% (2)

Number of Channels

1 (13)

4 (4)

Number of Pins

4 (13)

16 (4)

Output Device

Phototransistor (15)

Transistor (2)

Package Type

SO (13)

SOIC (4)

Special Features

Collector Emitter Voltage 80 V (Min.), Suitable for High Density Surface Mounting Application (4)

Suitable for High-Density Surface Mounting Applications Such as Small Switching Power Supplies And Programmable Controllers, TLP291 Consists of Photo Transistor Optically Coupled to a Gallium Arsenide Infrared Emitting Diode (4)

Can Operate Directly by AC Input Current, Suitable for High-Density Surface Mounting Applications Such as Programmable Controllers And Hybrid IC, TLP292 Consist of Photo Transistor Optically Coupled to Two InGaAs Infrared Emitting Diode (2)

Collector Emitter Voltage 80 V (Min.), Suitable for High Density Surface Mounting Applications (2)

Double Transfer Mold Technology, Hybrid Substrates That Require High Density Mounting, Programmable Controllers, System Appliance (2)

Suitable for High-Density Surface Mount Applications Such as Programmable Controllers, TLP291-4 Consists of Photo Transistors Optically Coupled to Gallium Arsenide Infrared Emitting Diodes (2)

Suitable for High-Density Surface Mounting Applications Such as Small Switching Power Supplies And Programmable Controllers, TLP293 Consists of a Low Input Type Photo Transistor Optically Coupled to an InGaAs Infrared Emitting Diode, Very Small And Thin C (1)

Typical Fall Time

3µs (13)

7µs (4)

Typical Rise Time

2µs (13)

4µs (4)

Maximum Wire Size AWG

24 AWG (5)

14 AWG (4)

16 AWG (4)

10 AWG (2)

Minimum Wire Size AWG

26 AWG (5)

16 AWG (4)

22 AWG (4)

12 AWG (2)

Gender

Female (10)

Male (4)

Thickness

6mm (5)

0.8mm (1)

10mm (1)

15mm (1)

1mm (1)

25mm (1)

6.4mm (1)

9mm (1)

Overall Length

28mm (2)

31mm (2)

42.06mm (2)

25mm (1)

28.5mm (1)

29.3mm (1)

33.5mm (1)

34mm (1)

Height

8.55mm (6)

16.5mm (2)

342mm (1)

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HARTING D-Sub High Density 62 Way Straight 2.41 mm Pitch Through Hole D-Sub Connector, with Screw Lock Male

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